Wireless Waves August 2001
In This Issue:
- General Dynamics Selects flexComm Digital Radio Subsystems
- Spectrum Showcases PowerPC™ Solutions at DSEi Conference
- Spectrum and Xilinx Partner at the Communications Design
Conference
- Solano™ Communications IC Enables DSP Multiprocessing
General Dynamics
selects flexComm Digital Radio Subsystems
General Dynamics has selected Spectrum’s flexComm digital radio subsystems
for its next generation of government wireless development and production systems.
The flexComm solution was a perfect fit for General Dynamics’ government
wireless program because of the high-density functionality, field-programmable
technology and quick delivery of a commercial-off-the-shelf (COTS) solution.
Read more about this announcement.
Spectrum Showcases PowerPC™ Solutions at DSEI Conference
A new line of PowerPC™ products will be on display in Spectrum’s booth at Defense
Systems Equipment International, September 11-14, 2001 in London, England.
Visit Spectrum at booth 1415 and learn more about the HCDR family of digital
radio products that are powered by Motorola’s MPC7410 PowerPC™ G4 microprocessor
with AltiVec™ technology. AltiVec technology adds superior floating-point
performance and parallel processing capabilities to Spectrum’s impressive line
of flexComm subsystems.
Learn more about Spectrum’s
HCDR products
Spectrum and Xilinx Partner at the Communications Design
Conference
Join Spectrum and Xilinx at the Communications Design Conference in San Jose,
CA, October 1–4, 2001. Spectrum and Xilinx are showcasing one of Spectrum’s
new High Channel Density Receiver (HCDR) subsystems. The HCDR subsystem is equipped
with an ePMC-FPGA I/O processing module with three Xilinx
XCV600E devices and a Mosport-VME
Octal ‘C6203 board.
More information about the Communications
Design Conference
Solano™ Communications IC Enables DSP Multiprocessing
The Solano Communications IC is a high throughput, off-the-shelf solution for
the telecommunications infrastructure marketplace. The Solano IC provides flexible,
high-bandwidth communications paths for multiple processors and I/O modules
that results in a system throughput many times higher than that offered by conventional
bussed or serial link communications.
To learn more about Spectrum’s Solano Communications IC, an application note
is available on TI’s
website
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© Spectrum Signal Processing Inc.
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